The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 1991
Filed:
Nov. 09, 1990
Applicant:
Inventors:
Ichiro Takahashi, Amagasaki, JP;
Hiromi Ito, Amagasaki, JP;
Goro Okamoto, Amagasaki, JP;
Kazuo Okahashi, Amagasaki, JP;
Kou Shimomura, Itami, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ;
U.S. Cl.
CPC ...
523435 ; 525476 ;
Abstract
A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.