The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1991
Filed:
Aug. 31, 1989
Michael J Little, Woodland Hills, CA (US);
Jan Grinberg, Los Angeles, CA (US);
Hugh L Garvin, Malibu, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
A 3-D IC chip assembly is formed from stacked substrates in which each individual substrate has a plurality of different IC chips retained in respective recesses. Conductive feedthroughs extend through the substrate from the side where the chips are located to the opposite side, with the chips electrically connected to the feedthroughs. An electrical routing network on the opposite side of the substrate from the chips provides desired interconnections between the chips by connecting to the feedthroughs. The routing can be formed by standard photolithographic techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile