The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1991
Filed:
Apr. 18, 1990
Osamu Horiuchi, Akishima, JP;
Gen Murakami, Machida, JP;
Hiromichi Suzuki, Tokorozawa, JP;
Hajime Hasebe, Hakodate, JP;
Kanji Otsuka, Higashiyamato, JP;
Yuuji Shirai, Kodaira, JP;
Takayuki Okinaga, Akishima, JP;
Takashi Emata, Akishima, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corp., Tokyo, JP;
Abstract
A semiconductor device comprising the fact that a semiconductor pellet is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base, and that external terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, and inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.