The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1991
Filed:
Nov. 29, 1988
Homer E Henschen, Carlisle, PA (US);
Michael J McKee, New Cumberland, PA (US);
Joseph M Pawlikowski, Lancaster, PA (US);
AMP Incorporated, Harrisburg, PA (US);
Abstract
Simultaneous solder connections of multiple electrical terminals to respective electrical leads is achieved by conducting thermal energy from an actuable heater body (10,40,50,60,70) to the multiple connection sites via the terminals (20,21,45) themselves, the terminals being formed integrally with the heater body. The terminals are scored, perforated, etc., to facilitate severence from the heater body after soldering. The preferred heater body takes the form of a copper substrate (17,27,41,51,61) having a skin depth surface layer (19,29,43,53,63,65) of magnetically-permeable, high resistance alloy. Alternating current of constant amplitude and high frequency is passed through the heater body and concentrated in the surface layer at temperatures below the Curie temperature of the alloy. For higher temperatures the current is distributed through the lower resistance substrate to limit further heating. During the time interval required for the surface layer to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt solder that is pre-deposited on the terminals and/or leads.