The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 1991

Filed:

Dec. 07, 1990
Applicant:
Inventor:

Christopher A Tarry, Sayre, PA (US);

Assignee:

GTE Products Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B / ;
U.S. Cl.
CPC ...
501 97 ; 501 98 ; 264 65 ; 264 66 ;
Abstract

A high density high strength ceramic article is disclosed having from about 70% to about 100% of its crystalline phases as alpha sialon, having less than about 20% by weight of its crystalline phases as beta sialon, having a density of greater than about 94% of the theoretical density, and having a flexural strength of greater than about 70 kpsi at about room temperature, a Knoop hardness of greater than about 14 GPa, and a Rockwell A hardness of greater than about 94. The process for producing the article is disclosed. The process involves forming a powder mixture consisting essentially of in percent by weight from about 48 to about 88 silicon nitride, from about 8 to about 30 aluminum nitride, from about 2 to about 16 of an oxygen containing compound of an element selected from the group consisting of yttrium, lithium, magnesium, calcium, scandium, cerium, rare earths, and combinations thereof, and from about 2 to about 12 of oxygen containing compounds of one or more metals as additives to aid densification, forming a green article from the mixture, and densifying the green article by one or more methods selected from the group consisting of sintering, sintering followed by hot isostatic pressing, and encapsulated hot isostatic pressing, at a temperature of from about 1600.degree. C. to about 2000.degree. C.


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