The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1991
Filed:
Sep. 04, 1990
Applicant:
Inventors:
Yoshimasa Kudo, Yokohama, JP;
Shinjiro Kojima, Chigasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 70 ; 357 74 ;
Abstract
A resin sealing type semiconductor apparatus includes semiconductor devices having electrodes. A plurality of leads include inner leads and outer leads, the former connected to the electrodes of the semiconductor devices by thin metal wires. A sealing resin layer covers at least the semiconductor devices and the inner leads. The outer leads, which are led out in one direction from the sealing resin layer, have two different types or more of pitches, the number of the pitches of each type being two or greater.