The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 1991

Filed:

Jan. 29, 1988
Applicant:
Inventors:

Joseph Pernyeszi, Scotts Valley, CA (US);

Michael D Walters, San Jose, CA (US);

Kevin Venor, Ft. Collins, CO (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 41 ; 357 30 ; 357 52 ; 357 54 ; 357 84 ;
Abstract

An opaque shield is provided for integrated circuits and comprises reflective particles of titanium dioxide and light-absorbing particles of carbon black suspended in polyimide. The reflective particles increase the effective path length of light traversing the carrier so that a much lower concentration of carbon black is required to render the shield opaque. The concentration of carbon black can be low enough so that its conductivity does not impair operation of the integrated circuit. In addition to shielding the integrated circuit from light, the shield also protects the integrated circuit from contamination. A fluid precursor material is formed by mixing titanium dioxide and carbon black particles into a polyamic acid solution. This solution is diluted, filtered and vacuum distilled to yield a suspension free of over-sized particles. The resulting suspension can be applied and patterned using conventional semiconductor processing techniques. As a result, an integrated circuit can be completely or selectively shielded as desired.


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