The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1991
Filed:
Oct. 18, 1989
Masakazu Achikita, Kashiwa City, JP;
Akihito Ohtsuka, Sakura City, JP;
Sumitomo Metal Mining Company Limited, Tokyo, JP;
Abstract
Disclosed is a composition for injection moulding which is composed of a sinterable powder comprising at least one metal or alloy and a binder. The binder contains from 10 to 80% by weight of a low-density polyethylene from 10 to 80% by weight of a paraffin wax and from 5 to 35% by weight of a boric acid ester. The ratio of the sinterable powder to the binder in the composition is from 30 to 70% by volume of the former and from 70 to 30% by volume of the latter. The binder can be removed from the green body to be prepared by injection-moulding the composition unexpectedly rapidly without interfering with the properties of the final product sintered.