The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 1991

Filed:

Apr. 16, 1990
Applicant:
Inventors:

Yuziro Ito, Yokohama, JP;

Takashi Higashiogawa, Yokohama, JP;

Masahiro Matsuura, Yokohama, JP;

Koichi Orii, Yokohama, JP;

Yasumasa Yamaguchi, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B / ; C01B / ; C01B / ;
U.S. Cl.
CPC ...
264 12 ; 264 13 ; 264 56 ; 423335 ; 423338 ; 423339 ;
Abstract

A method of manufacturing spherical silica particles comprising the steps of processing in an acid-containing solution and then washing with water the coagulant derived from an aqueous alkali metal silicate solution extruded through pores in a water-miscible organic medium or acid solution, wet-grinding the amorphous silica thus obtained in a liquid dispersion medium to obtain a fine particle silica suspension with a weight average particle size of 10 .mu.m or less, spray-drying this fine particle silica suspension with hot air and sintering the spherical granulated silica thus obtained. According to the present invention, the high-purity spherical silica particles can be obtained with high solidity and adjusted surface smoothness without any complicated operation or waste water treatment for use as a sealant filler for highly-integrated IC electronic parts.


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