The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 1991
Filed:
Nov. 15, 1989
Applicant:
Inventors:
Shunji Yamauchi, Fukuoka Prefecture, JP;
Minoru Tanaka, Fukuoka Prefecture, JP;
Kenitiro Sakamoto, Fukuoka Prefecture, JP;
Yutaka Morita, Fukuoka Prefecture, JP;
Toru Kidera, Fukuoka Prefecture, JP;
Hiroki Mieda, Fukuoka Prefecture, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437210 ; 437212 ; 437217 ; 437250 ; 437949 ;
Abstract
An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust collecting device for collecting dust which is suspended by the air inside the dust-proof cover.