The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 1991
Filed:
Jul. 03, 1989
Applicant:
Inventors:
Kouichirou Tsutahara, Itami City, JP;
Hiroshi Tanaka, Itami City, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B / ;
U.S. Cl.
CPC ...
219462 ; 392339 ;
Abstract
A semiconductor wafer heating device includes a hollow heating stage. A semiconductor wafer is disposed over one surface of the heating stage and a heater is provided over the other surface thereof. A fluid having an excellent heat conductivity which is filled in the hollow space of the heating stage is stirred uniformly. In consequence, the surface temperature of the heating stage can be made uniform without employing a thick heating stage, and an excellent temperature control of the heating stage can be ensured.