The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 1991
Filed:
Nov. 17, 1989
Applicant:
Inventors:
Rensei Futatasuka, Aizuwakamatsu, JP;
Yutaka Koshiba, Aizuwakamatsu, JP;
Shunich Chiba, Aizuwakamatsu, JP;
Toyoaki Orikasa, Aizuwakamatsu, JP;
Seiji Noguchi, Aizuwakamatsu, JP;
Takuya Idoshita, Aizuwakamatsu, JP;
Assignee:
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ; C22C / ;
U.S. Cl.
CPC ...
420473 ; 420476 ; 420481 ;
Abstract
A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.