The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 1991
Filed:
Aug. 07, 1989
Mitugu Shirai, Hadano, JP;
Kaoru Katayama, Hadano, JP;
Hideaki Sasaki, Hadano, JP;
Shinichi Kazui, Hadano, JP;
Ryohei Satoh, Yokohama, JP;
Tateoki Miyauchi, Yokohama, JP;
Mamoru Kobayashi, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.