The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1991
Filed:
Sep. 07, 1989
Yoshiharu Takahashi, Hyogo, JP;
Shuichi Osaka, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A lead frame of a package cast from mold resin is composed of a die bond pad section on which a semiconductor chip is placed and connected to a plurality of leads placed around the die bond pad section. The die bond pad section is formed of a length of an elongated material of a reduced width, i.e., having a line-like form disposed as a pattern in the form of a Peano curve. The die bond pad section has one or a plurality of such supporting sections integrally connected to and supported by one or more extension lead or leads. The die bond pad section formed by the elongated material has a low stiffness, and thus serves to prevent cracks from being formed in the package or in the semiconductor ship due to thermal contraction effects.