The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1991
Filed:
Feb. 24, 1989
Toray Industries, Inc., Tokyo, JP;
Abstract
An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 10.sup.2 to 10.sup.6 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 .mu.m and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas impermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA., at the bonded surface in the thickness direction thereof.