The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 1991

Filed:

Sep. 08, 1989
Applicant:
Inventor:

Vivek Mansingh, Santa Clara, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F / ; H05K / ;
U.S. Cl.
CPC ...
165 803 ; 165185 ; 361383 ; 361384 ;
Abstract

Apparatus for cooling an electronic circuit module includes a heat sink in thermal contact with the circuit module and a device for directing cooling gas at the heat sink. The heat sink includes multiple fins defining channels between them, a base having a surface for contact with the circuit module, and a plurality of passages located between the fins and the base and interconnecting with the channels. At least a part of the cooling gas flows between the fins and absorbs thermal energy from the fins and then flows through the passages and absorbs additional thermal energy. The fins and the passages provide a large area of contact with the cooling air and reduce the pressure drop through the heat sink. The heat sink provides a path for efficient conduction of thermal energy from the circuit module to the fins and prevents the formation in the cooling air of recirculating eddies which can reduce heat transfer.


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