The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 1991
Filed:
Nov. 15, 1989
Applicant:
Inventors:
Takashi Nakajima, Sagamihara, JP;
Kenji Kubozono, Sagamihara, JP;
Toshihiko Mori, Sagamihara, JP;
Takefumi Ito, Amagasaki, JP;
Kimio Hashitsume, Amagasaki, JP;
Shinichi Iwase, Sagamihara, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; C21D / ;
U.S. Cl.
CPC ...
148 132 ; 148 / ; 420488 ; 420492 ;
Abstract
A high strength Cu-Ni-Sn alloy, comprising 3-25% Ni, 3-9% Sn, 0.05-1.5% Mn, balance Cu, is heated to a temperature of 800.degree. C. or above in a single-phase region. This heat treatment is followed by quenching and subsequent heating at a temperature range of 600.degree.-770.degree. C. in a two-phase region, followed by quenching and a finishing process with a ratio of 0-60%. Thereafter, the processed alloy is subjected to a final heat-treatment at a temperature of 350.degree.-500.degree. C.