The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 1991

Filed:

Mar. 29, 1989
Applicant:
Inventors:

Kenneth Brown, Evansville, IN (US);

Richard E Riley, Riverside, CA (US);

Assignee:

Hamilton Standard Controls, Inc., Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H01H / ;
U.S. Cl.
CPC ...
174260 ; 174262 ; 200 / ;
Abstract

A rotary digital contacting encoder (FIG. 1) including a base (5), comprising - a base epoxy disk (501) with three external, pre-molded in place, connector pins (P.sub.1 -P.sub.3) on its exterior side extending through it, and a conductive layer in the form of two concentric layer rings (502 & 503; FIG. 4); and - an encoder element made of a 'Kapton' insulating substrate (510) carrying two, like concentric cog rings (511B & 511A; FIGS. 3 & 7) on its top side. Conductive vias (512 & 513) electrically interconnect each respective cog ring with its respective conductive layer ring and its respective external connector pin, the vias forming conductive paths through the insulating substrate between the conductive layer and the cog rings. The presence of the conductive layer 502/503, which can be screen printed on the base disk, greatly simplifies the relative alignment of the encoder element, conductor pads and terminals. Using the conductive layer the encoder element can be positioned at almost any angular location, while still obtaining proper electrical contact with the terminal pins. The via tunnels are etched out (FIG. 6A) and then filled with conductive materials before the encoder element (510/511A-B) is bonded to the base element (501/502-503).


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