The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1991
Filed:
Aug. 25, 1989
Sugio Otani, Kiryu, JP;
Michio Tsuyuguchi, Urawa, JP;
Haruyuki Kano, Ibaragi, JP;
Yoshihisa Sone, Ibaragi, JP;
Kenji Kageyama, Tokyo, JP;
Toshiaki Mabuchi, Chofu, JP;
Sumikin Chemical Co., Ltd., Tokyo, JP;
Abstract
A condensed polycyclic, polynuclear aromatic thermosetting resin with improved moldability which is prevented from forming a cloud on a mold during molding is disclosed. The resin is a prepolymer derived by condensation polymerization of a condensed polycyclic aromatic compound or a mixture thereof with a monocyclic aromatic compounds and an aromatic compound having at least two hydroxymethyl groups as a crosslinking agent in the presence of an acid catalyst. The resin has a flow temperature of not higher than 150.degree. C. The acid catalyst is water-insoluble or when it is water-soluble the resin has an insolubilized acid ratio of at least 50%. The resin is useful in the manufacture of thermoset molded articles having good heat resistance and good mechanical and electrical properties. It can be blended with a filler and/or reinforcing agent to form a molding compound.