The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 1991

Filed:

Jan. 16, 1990
Applicant:
Inventor:

David M Morton, Eau Claire, WI (US);

Assignee:

Cray Research, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
228176 ; 2281802 ; 228123 ; 361385 ; 361386 ; 361412 ; 357 82 ;
Abstract

The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.


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