The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 1991

Filed:

Jun. 27, 1989
Applicant:
Inventors:

William A Clark, Randolph, NJ (US);

Michael A Oien, Chatham, NJ (US);

Walter Pelosi, Randolph, NJ (US);

Assignee:

AT&T Bell Laboratories, Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361412 ; 361398 ; 361403 ; 361406 ; 361414 ;
Abstract

Disclosed is an apparatus involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.


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