The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 1991

Filed:

Dec. 14, 1989
Applicant:
Inventors:

Toshikazu Nagashima, Matsusaka, JP;

Haruki Kuramashi, Matsusaka, JP;

Yoshihiro Nishida, Matsusaka, JP;

Masahiro Hirukawa, Ise, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
524767 ; 524789 ; 524493 ; 524492 ; 528 12 ; 528 26 ; 528 40 ; 10628713 ; 10628714 ; 10628716 ;
Abstract

The invention provides a liquid coating composition for forming a transparent and hard coating film on a plastic member such as a polycarbonate or polymethyl methacrylate plate. The liquid composition comprises 100 parts by weight of an organotrialkoxysilane R.sup.1 Si(OR.sup.2).sub.3, where R.sup.1 is a C.sub.1 - or C.sub.2 -alkyl group and R.sup.2 is a C.sub.1 -, C.sub.2 - or C.sub.3 -alkyl group, 5-20 parts by weight of an organotrialkoxysilane R.sup.3 Si(OR.sup.2).sub.3, where R.sup.3 is an organic group containing epoxy group, 50-200 parts by weight of an aqueous colloidal silica sol in which the content of SiO.sub.2 is 10-40 wt %, and 0.5-3 parts by weight of a dicarboxylic acid (CF.sub.2).sub.n (COOH).sub.2, where n is an integer from 1 to 5, preferably hexafluoroglutaric acid. On a surface of a plastic member a coating film of this composition is partially cured at 70.degree.-150.degree. C. to turn into a fairly hard but still pliable film. Then the plastic member can be shaped so as to bend the coated surface without suffering from cracking or peeling of the partially cured film. After that the film is treated with an aqueous alkali solution and then further cured at 80.degree.-150.degree. C.


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