The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 1991
Filed:
Sep. 29, 1989
Gerald J Julien, Puyallup, WA (US);
Steven P Robinson, Seattle, WA (US);
Ronald H Bondy, Seattle, WA (US);
The Boeing Company, Seattle, WA (US);
Abstract
A method for creating an elongate passage of a desired cross-sectional shape and size within a component. A shape memory metal alloy is formed into an elongate element, such as a wire (16), having the cross-sectional shape and size desired of the elongate passage. The wire is embedded within a component (10) as the component is manufactured, e.g., by laying-up the component from a fiber/resin composite and curing it, or by casting the component in a mold (50) from a liquid that hardens around the memory metal alloy, embedding it in place. The liquid may comprise glass, ceramic, thermoplastic, or metal having a lower melting point than the memory metal alloy. The wire is then pulled from the component, by applying a force sufficient to convert the memory metal alloy from a soft martensitic state to a stress-induced martensitic state, thereby plastically and inelastically deforming it so that it lengthens. As the memory metal alloy wire lengthens, its cross-sectional area decreases. In addition, conversion of the memory metal alloy to its stress-induced martensitic state increases its tensile strength, preventing it from being broken by the applied force. Due to the decrease in the diameter of the wire and its increase in tensile strength, it is easily pulled free from the component, leaving behind a void having substantially the same cross-sectional shape and size as the wire.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile