The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 1991

Filed:

Apr. 10, 1989
Applicant:
Inventors:

Katsuhide Natori, Yokohama, JP;

Isao Watanabe, Sagamihara, JP;

Koji Katsuyama, Yokohama, JP;

Isao Kawamura, Yokohama, JP;

Haruhiko Yamamoto, Yokohama, JP;

Takeshi Nagai, Yokohama, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; F28D / ;
U.S. Cl.
CPC ...
165-1 ; 165185 ; 165 803 ; 165 804 ; 357 81 ; 357 82 ; 420555 ; 361385 ; 361386 ; 361387 ;
Abstract

A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.


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