Uptapered single-mode optical fiber package for optoelectronic components

Abstract

A package for an optoelectronic device, such as a laser, having a photo-active element optically coupled to an uptapered single-mode optical fiber which connects said optoelectronic array to an external device includes a housing having a solderable substrate to which the device is secured, a graded index lens also secured to said substrate at a distance calculated to provide a known magnification of light beam emanating from said laser and an uptapered single-mode optical fiber mechanically positioned and actively aligned to said mangified light beam to achieve optimal optical coupling to said optoelectronic device. The package includes a plurality of reference marks and surfaces such that the laser, the lens and the uptapered end of a single-mode optical fiber may be positioned for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate. The package also includes a fiber tube and flange for mechanically positioning the uptapered fiber. The precisely calculated spacing based on the spacing of said photo-active element, the magnification of said lens, and the fiber positioning is achieved by mechanical means.