The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 1991
Filed:
Jul. 27, 1990
Applicant:
Inventor:
Kenneth R Thompson, Sunrise, FL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H05K / ;
U.S. Cl.
CPC ...
2281802 ; 228215 ; 361406 ; 174261 ;
Abstract
A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.