The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1991
Filed:
Mar. 23, 1989
Applicant:
Inventors:
Chi-Long Lee, Midland, MI (US);
Robin L Willis, Jr, Midland, MI (US);
Assignee:
Dow Corning Corporation, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B32B / ;
U.S. Cl.
CPC ...
42840222 ; 264 47 ; 42721334 ; 42721336 ; 42840221 ; 42840224 ; 528 15 ; 528491 ; 528901 ;
Abstract
Platinum-group metals and compounds thereof are microencapsulated within one or two layers of thermoplastic organic polymers. The layer or layers are deposited using known prior art microencapsulation techniques. The microcapsules can be incorporated into storage-stable one-part polyorganosiloxane compositions that cure by a platinum-catalyzed hydrosilation reaction.
Lee, Chi-Long. (1991). Microencapsulated platinum-group metals and compounds thereof (U.S. Patent No. 5009957). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5009957
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile