The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1991
Filed:
Jan. 18, 1990
Applicant:
Inventors:
Tadashi Mitarai, Fukuoka, JP;
Makoto Kanda, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D / ; F27D / ;
U.S. Cl.
CPC ...
432121 ; 432-5 ; 432-6 ; 432 11 ; 432122 ; 432239 ; 432 33 ;
Abstract
A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.
Quick Actions:
Mitarai, Tadashi. (1991). Method and apparatus for preheating semiconductor chips (U.S. Patent No. 5009590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5009590
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile