The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 1991

Filed:

Nov. 18, 1988
Applicant:
Inventors:

Raymond J Keogh, Huntington, NY (US);

Ronald Morino, Shelter Island Heights, NY (US);

R Page Burr, Matinicus, ME (US);

Assignee:

AMP-AKZO Corporation, Melville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
32420716 ; 324226 ; 324262 ; 29846 ;
Abstract

In a system for determining the relative position of a first object with respect to a second object, electrical detection of registration is achieved. This registration can be used during the manufacture of printed circuit boards or discrete wiring boards to determine the registration between layers of wiring, or between wiring layers and printed circuit layers. The system introduces an a.c. current at a suitable frequency into at least one first conductive pattern wired or etched or otherwise provided near the perimeter of a printed or wired first layer of a circuit board panel. The panel having the first pattern is moved relative to similarly wired second conductive patterns on a second layer or base plate, mounting table, etc., to which detection circuits are connected. Voltage induced in the second patterns is detected and indicates the positional relationship between the first and second conductive patterns and, hence, objects associated with such patterns. The system is well adapted for use in the manufacture of circuit boards, with errors between a distorted panel layer and the next succeeding layer may be evenly distributed or averaged to produce optimum results.


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