The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 1991

Filed:

Oct. 20, 1989
Applicant:
Inventors:

Raymond L Brown, Fountain Valley, CA (US);

Clifford L Shock, Jr, Santa Ana, CA (US);

Assignee:

Hughes Aircraft Company, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 524 ; 357 74 ;
Abstract

A high current feedthrough package comprising a plurality of alternating rings respectively comprising a thermally conductive material and an electrically conductive material. The thermally conductive rings comprise a thermally conductive ceramic material such as aluminum nitride, while the electrically conductive rings comprise a material such as molybdenum, or one of its alloys, for example. The package is thus comprised of alternating rings or laminations of aluminum nitride and molybdenum, for example, that are stacked or layered to form a wall. The layered wall is brazed in a single step onto a base. The molybdenum rings act as high current feedthroughs and comprise tabs on the inner and outer perimeter which are available for interconnection to devices disposed within the enclosure and to external circuits. The aluminum nitride rings provide electrical isolation between the feed-through rings. The high thermal conductivity of the molybdenum and aluminum nitride provides for excellent thermal dissipation from the package. Forced convective cooling may also be used to further increase the current carrying capability of the package. Methods of fabricating the package are also disclosed.


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