The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 1991

Filed:

Feb. 17, 1989
Applicant:
Inventors:

Teruyuki Takahashi, Ashiya, JP;

Mitsuru Kohno, Sanda, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523406 ; 523410 ; 523412 ;
Abstract

Thermal adhesive type coating composition including (A) an emulsion of a thermoplastic synthetic resin having a glass transition temperature of not lower than 60.degree. C., (B) an emulsion of an epoxy resin, (C) an amine base curing agent for the epoxy resin which is capable of reacting with the component (B) when heated, and (D) a film forming assistant agent having solubility in water at 20.degree. C. of not higher than 20 g/100 cc and having solubility therein of water at 20.degree. C. of not lower than 0.5 g/100 cc, the weight ratio of the solid resin contents of the component (A) to those of the component (B) being 60/40 to 98/2, is disclosed. The composition protects a substrate coated with the composition as the coating at ambient temperature and, when heated under pressure application, causes the substrates coated with the composition to be bonded to each other with a strong adhesive strength.


Find Patent Forward Citations

Takahashi, Teruyuki. (1991). Thermal adhesive coating composition based on epoxy resin, high tg (U.S. Patent No. 5008308). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5008308

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