The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1991
Filed:
Dec. 29, 1989
Richard F Frankeny, Elgin, TX (US);
Karl Hermann, Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A heat sink for utilization in thermal management of high density integrated circuit substrates is disclosed. Each heat sink includes at least one compliant bag containing a mass of thermally conductive fluid. Within each compliant bag is an aperture which contains a thin pliable metallic membrane having a high Z axis thermal conductivity. The metallic membrane is adapted to slidably mate with a surface of an integrated circuit device to permit relative motion during thermal mismatch while enhancing thermal conductivity from the integrated circuit device into the thermally conductive fluid. A second metallic membrane is preferably mounted to the upper surface of the compliant bag and is thermally coupled to a plurality of cooling fins. In one embodiment of the present invention, a plurality of such compliant bags are serially interconnected and a pump is utilized to circulate fluid through each compliant bag. In this embodiment, a pair of rigidly mounted needle valves may be utilized to automatically couple the fluid pump to the plurality of compliant bags in response to the electrical connection of a substrate incorporating such a heat sink.