The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 1991
Filed:
Dec. 07, 1988
Haruhisa Maruyama, Yamanashi, JP;
Ken-ichi Ishiguro, Yamanashi, JP;
Hiroaki Watanabe, Yamanashi, JP;
Osamu Yagisawa, Yamanashi, JP;
Pioneer Electronic Corporation, Tokyo, JP;
Abstract
An apparatus for injection molding a substrate of an information recording disk in which melted molding material is injected into a mold space after a pair of mold bodies are clamped together. An uneven surface area is provided between a cutting device for cutting the cured molding material at the molding surface and an aperture for supplying the pressurized gas for causing the cured molding material to be released. The flow of pressurized gas through the cut portion of the cured molding material is prevented and force is generated by the pressurized gas causing the cured molding material and a stamper forming the molding surface to release uniformly from the mold.