The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1991
Filed:
Aug. 18, 1988
Yoshimi Yoshino, Inuyama, JP;
Kenichi Ao, Obu, JP;
Ichiro Izawa, Anjo, JP;
Toshikazu Arasuna, Kariya, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
According to this invention, a device for detecting magnetism comprises; a substrate, an interposed insulating layer containing impurities therein, formed on the substrate, and a ferromagnetic magnetoresistive element formed on the interposed layer, wherein at least a portion of the interposed layer on which the ferromagnetic magnetoresistive element is formed has a concentration of impurities of less than a predetermined value. Further, in the device of this invention, the surface of the layer interposed between the substrate and the ferromagnetic magnetoresistive element has a surface roughness of less than 120 and an angle between a contacting surface of a conductive wiring and the ferromagnetic magnetoresistive element and the surface of the interposed layer is less than 78 degrees. Therefore, a device wherein a deterioration of the quality film of the ferromagnetic magnetoresistive element can be avoided and a reduction of the ratio of the resistance variation of the ferromagnetic magnetoresistive element can be maintained at less than 10% can be obtained, and further, a device wherein the generation of noise can be effectively suppressed so that the device is highly sensitive to magnetism and has a high S/N ratio, and further, the breakdown ratio caused by wiring breakages is effectively reduced, can be obtained.