The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1991
Filed:
Jan. 06, 1989
Applicant:
Inventor:
Scott C Blackstone, Needham, MA (US);
Assignee:
Unitrode Corporation, Lexington, MA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437225 ; 437 31 ; 437 74 ; 437946 ; 437974 ; 148D / ; 148D / ;
Abstract
A process for fabricating a semiconductor device by forming a diffusion region in a first semiconductor wafer and bonding the surface of the first semiconductor wafer having the diffused region to a second semiconductor wafer to form a low resistance buried layer. The process includes further diffusion to provide an external electrical contact with the buried layer. Further enhancements are provided by selectively forming voids and/or selectively applying materials of greater and lesser conductivity on at least one of the semiconductor wafers before bonding, forming complex internal semiconductor structures in the bonded wafer structures.