The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 1991
Filed:
Oct. 10, 1989
Applicant:
Inventors:
Keizo Shimamura, Kawasaki, JP;
Kagetaka Amano, Atsugi, JP;
Tatsuyoshi Aisaka, Ebina, JP;
Satoshi Hanai, Yokohama, JP;
Kohsoku Nagata, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
75233 ; 75234 ; 75235 ; 75236 ; 75238 ; 75241 ; 75244 ; 419 12 ; 419 13 ; 419 14 ; 419 15 ; 419 16 ; 419 17 ; 419 19 ; 419 23 ; 428552 ;
Abstract
A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.