The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 1991
Filed:
Sep. 28, 1989
Applicant:
Inventors:
Mitsukiyo Tani, Odawara, JP;
Hideo Shiraishi, Atugi, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Computer Electronics Co., Ltd., Hadano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228110 ; 228111 ; 228-11 ; 219 5621 ; 219 5622 ; 219 8518 ;
Abstract
A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.