The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1991
Filed:
Nov. 28, 1989
Arthur H Iversen, Saratoga, CA (US);
Coriolis Corporation, Saratoga, CA (US);
Abstract
There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect substrate, said semi-conductor device having a surface opposing said surface prepared with said electrical interconnect means, said opposing surface being a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, one surface of said conduit having apertures corresponding in placement and geometry to said heat transfer surfaces of said semi-conductor devices mounted on said electrical interconnect means wherein said heat transfer surfaces and said conduit surface containing said apertures are approximately coincident thereby providing an approximately hydraulically smooth surface for the flow of coolant thereby minimizing undesirable flow characteristics such as cavitation and vortex shedding.