The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1991
Filed:
Aug. 07, 1989
Applicant:
Inventor:
RomanoLuigi, Monza, IT;
Assignee:
SGS Microelettronica S.p.A., Agrate Brianza, IT;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357074 ; 357 81 ; 357 72 ; 357 68 ; 439571 ; 439431 ; 439432 ;
Abstract
A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.