The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1991
Filed:
Jul. 27, 1983
Sheldon H Butt, Godfrey, IL (US);
Olin Corporation, New Haven, CT (US);
Abstract
An integrated circuit assembly for electrical applications is disclosed. The assembly includes a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding is bonded to opposite surfaces of the substrate. The cladding consists essentially of about 15% to about 70% nickel and the balance essentially copper. The resulting lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. A second embodiment of the integrated circuit assembly also relates to a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding material is bonded to opposite surfaces of the substrate for providing the circuit assembly with relatively high electrical and thermal conductivity. A second cladding is bonded to opposite surfaces of the first cladding so that the lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. and a thermal conductivity of about 30 to 75 B.T.U./ft.sup.2 /ft/hr/.degree.F.