The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1991
Filed:
Sep. 09, 1988
Applicant:
Inventors:
Shigeki Hirasawa, Ibaraki, JP;
Takuji Torii, Ushiku, JP;
Tomoji Watanabe, Ibaraki, JP;
Toshihiro Komatsu, Ibaraki, JP;
Kazuo Honma, Ibaraki, JP;
Akihiko Sakai, Ibaraki, JP;
Tetsuya Takagaki, Tokorozawa, JP;
Toshiyuki Uchino, Tokyo, JP;
Hiroto Nagazomo, Tokyo, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27B / ;
U.S. Cl.
CPC ...
219390 ; 219382 ; 219411 ; 118729 ;
Abstract
An apparatus for containing semiconductor wafers and performing heat treatment thereon. Heaters disposed in a high temperature furnace form at least one heating space therein. An insertion and retrieval aperture is disposed at the lower portion of each heating space for allowing passage of wafers therethrough. Each of the heating spaces is adapted to receive one or two wafers and to provide simultaneous and uniform heat treatment on the wafers.