The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 1991
Filed:
Dec. 04, 1989
Applicant:
Inventors:
Kenichi Yanagisawa, Utsunomiya, JP;
Naoki Mogi, Utsunomiya, JP;
Hironori Ohsuga, Utsunomiya, JP;
Hiroshi Shimawaki, Utsunomiya, JP;
Assignee:
Sumitomo Bakelite Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
523443 ; 523466 ; 525481 ; 525482 ; 525484 ; 525485 ; 525486 ; 525488 ; 525504 ; 525507 ;
Abstract
An epoxy resin composition for semiconductor sealing which comprises, as essential components,
Yanagisawa, Kenichi. (1991). Epoxy resin composition for semiconductor sealing employing (U.S. Patent No. 5001174). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5001174
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile