The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 1991

Filed:

May. 26, 1989
Applicant:
Inventors:

Akira Kawai, Itami, JP;

Shigeo Uoya, Itami, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437231 ; 148D / ; 134 33 ;
Abstract

A method of applying a treatment liquid to a semiconductor wafer to form a coating include rotating a semiconductor wafer in its own plane within a hermetically-sealed container, discharging a cleaning fluid through a cleaning fluid nozzle onto the top surface of the wafer as it rotates, and then discharging a treatment liquid through a treatment liquid nozzle onto the center of the top surface of the wafer as it rotates. An apparatus for coating a treatment liquid on a semiconductor wafer comprises a hermetically-sealed container, a wafer chuck which rotates a semiconductor wafer in its own plane, a treatment liquid nozzle for connection to a supply of treatment liquid and discharging the treatment liquid onto the center of the top surface of the wafer as it rotates, and a cleaning fluid nozzle which is disposed to discharge a pressurized cleaning fluid onto the top surface of the wafer as it rotates.


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