The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 1991

Filed:

Jun. 20, 1989
Applicant:
Inventors:

Josephus M Van Laarhoven, Eindhoven, NL;

Wilhelmus F Gootzen, Eindhoven, NL;

Michael F Bellersen, Hamburg, DE;

Trung T Doan, Boise, ID (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437 50 ; 437 73 ; 437194 ; 437927 ; 357 65 ;
Abstract

Spaced-apart regions (2) each having top (2a) and side walls (2b) meeting at an edge (20) are defined on a surface (1a) of a substructure (1) forming part of the device. A layer (3) of insulating material is provided over the surface (1a) and regions (2), so that the insulating material is provided preferentially at the edges (20) of the regions (2) to form adjacent the edges (20) portions (31) of the insulating material which overhang the underlying insulating material (32) provided on the surface (1a) and define a void therein. The insulating material layer (3) is then etched anisotropically to expose the top walls (2a). During the anisotropic etching the overhanging portions (31) initially mask the underlying insulating material provided on the surface (1a) so that the etching of the underlying insulating material is controlled by the etching away of the overhanging portions (31) and when the top walls (2 a) are exposed relatively gently sloping spacers or portions (30) of the insulating material remain on the side walls (2b). A further insulating material layer (4) may then be provided over the structure.


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