The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 1991
Filed:
Apr. 02, 1990
Kenneth W Dudley, Sudbury, MA (US);
Richard H Edgar, Chelmsford, MA (US);
E Eugene Eves, II, Westford, MA (US);
Raytheon Company, Lexington, MA (US);
Abstract
A test bonding apparatus comprising a rectangular wave-guide having a first pair of spaced opposing side walls attached to an orthogonal pair of spaced opposing side walls which are relatively wider. The waveguide includes an input portion, an intermediate bonding chamber portion and a terminating end portion which disposed in communication with one another. Coupled to the input portion is a microwave source and a coolant source for propagating consistently through the bonding chamber portion microwave energy having a predominant frequency associated with a predetermined wavelength, and a flow of coolant fluid. The relatively wider side walls in the bonding chamber portion of the waveguide have disposed along their longitudinal centerlines respective aligned slots. Each of the slots has opposing longitudinal edges disposed adjacent open ends of respective quarter wavelength chokes which are supported externally of the waveguide. Thus, a high impedance is established at each of the slots for preventing leakage of microwave energy therefrom. Within the bonding chamber portion, an aligned pair of dielectric clamping plates are supported by respective dielectric grid-like structures which permit passage of microwave energy and coolant fluid longitudinally through the bonding chamber portion. The terminating end portion is provided with a matched load for dissipating microwave energy and with a screened output aperture for permitting egress of heat carrying coolant fluid.