The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 1991

Filed:

Jun. 17, 1988
Applicant:
Inventors:

Anil Nadkarni, Mentor, OH (US);

Prasan K Samal, Pepper Pike, OH (US);

James E Synk, New York, NY (US);

Assignee:

SCM Metal Products, Inc., Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
505-1 ; 75252 ; 75255 ; 75229 ; 75232 ; 75233 ; 75234 ; 75235 ; 75240 ; 75244 ;
Abstract

There is provided a substantially fully dense powdered metal composite comprising a highly conductive metal or metal alloy matrix having dispersed therein discrete microparticles of a refractory metal oxide and discrete macroparticles of a mechanical or physical property-conferring additive material. The respective components undergo minimal alloying or interdispersion because sintering is not utilized in forming the composite. These composites are characterized by high thermal or electrical conductivity and a desired property (controlled thermal expansion, high strength, wear and arc erosion resistance, or magnetic) attributable to the composite forming material, like refractory metal, alloy, or compound. The composites are useful in forming lead frames for integrated circuit chips, electric lamp lead wires, electrical contact members, and discrete component leads.


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