The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 1991

Filed:

Dec. 29, 1988
Applicant:
Inventors:

Tohei Moritani, Kurashiki, JP;

Susumu Fukutome, Kurashiki, JP;

Yasuo Motoishi, Kurashiki, JP;

Hidemasa Oda, Kurashiki, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
428 366 ; 428 367 ; 428412 ; 4284763 ; 428480 ; 428483 ;
Abstract

This invention provides a gas-barrier multilayered packaging material which comprises an outer layer of a composition comprising 55-97 wt % of an EVOH and 45-3 wt % of a resin selected from the group consisting of polyamide, polyolefin, polyester and polycarbonate and an inner layer comprising a hydrophobic thermoplastic resin having a low moisture permeability; and further provides a gas-barrier multilayered packaging material with comprises an outer layer comprising a resin layer having a moisture permeability (measured at 40.degree. C., 90% RH) of at least 40 g/m.sup.2 day, an intermediate layer of a composition comprising 55 to 97% by weight of an EVOH and 45 to 3% by weight of a resin selected from the group consisting of polyamide, polyolefin, polyester and polycarbonate and an inner layer comprising a hydrophobic thermoplastic resin layer having a moisture permeability lower than that of the outer layer. Both of them are useful as packaging materials to be used for boil sterilization or retort sterilization.


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