The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 1991
Filed:
Jun. 06, 1988
Applicant:
Inventors:
William J Parr, Naperville, IL (US);
Ronald E Hutton, Faversham, GB;
Paul Y Moy, Des Plaines, IL (US);
Dieter Frank, Naperville, IL (US);
David A Strawser, Prospect Heights, IL (US);
Assignee:
Akzo America Inc., New York, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427123 ; 427337 ; 427367 ; 427371 ; 427370 ; 4273831 ;
Abstract
A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
Parr, William. (1991). Conductive metallization of substrates via developing agents (U.S. Patent No. 4997674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4997674
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile