The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 1991
Filed:
Jun. 01, 1990
Applicant:
Inventors:
Shunji Yamauchi, Fukuoka, JP;
Hiroki Mieda, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ; H01L / ;
U.S. Cl.
CPC ...
425116 ; 26427217 ; 425121 ; 4251261 ; 425543 ;
Abstract
An apparatus for producing semiconductor devices includes a resin molding section for resin-molding semiconductor chips, a loading section for supplying a lead frame, to which the semiconductor chips are bonded, to the resin molding section, a tablet supplying device which supplies a resin tablet to the resin molding section, an unloading section which takes out the resin-molded semiconductor chips with the lead frame from the resin molding section, and a dust cover which covers the resin molding section, the tablet supplying device and the unloading section.