The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1991
Filed:
Nov. 14, 1988
Robert A Christiansen, Salvisa, KY (US);
Joel A DiGirolamo, Lexington, KY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A copper supporting sheet (5) has holes (9) for connecting semiconductor chips (3) to surface mount components (27). A laminate of polyimide (7) has holes (13) corresponding to the supporting layer holes (9) with copper 15 covering those holes (13). In addition to crossing those holes (13), the copper 15 forms conventional circuit patterns. The side having circuit patterns is populated by surface mount techniques with components (27). The opposite side has silicon chips (3) attached to the copper sheet (5) adjacent to holes (9). Wires (17) are ultrasonically bonded to the chips (3) and extended to the inside of the holes (13) in the polyimide layer (7), where they are ultrasonically bonded to copper (15). Crossover connection of the circuit patterns (17a) are achieved using the same technique. The circuit board is densely populated and cost-effective, with good heat dissipation characteristics.